PCBA capability

PCB Assembly Capabilites
No.	Item
	Stencil size range	*29inch 29inch**
1	SMT	Position accuracy: 25um
2		Component size: 0201--150mm
		Component size: 0201--150mm
4		*Max PCB size: 680mm 500mm**
5		*Max PCB size: 680mm 500mm**
6		*Min PCB size: 50mm 50mm**
7		PCB thickness: 0.5mm~6.0mm
8		Min IC Pitch: 0.4mm
9	Wave Solder	Max. PCB width: 450mm
10		Min. PCB width: no limited
11		Component height: top 120mm/bottom 15mm
12	Min. BGA pitch	0.2mm
13	Max. BGA size	*74mm 74mm**
14	BGA Ball Pitch	Min. 1.0mm Max. 3.0mm
15	BGA Ball Diameter	Min. 0.4mm Max. 1.0mm
16	QFP Lead Pitch	Min. 0.38mm Max. 2.54mm
17	Testing	X-ray, AOI, Microscope 20X
18	Testing	ICT, Function Test, Temperature cycling
19	Frequency of Stencil Cleaning	5~10pc per time