FPC capacity

Dewell Manufacture Capabilites
No.	Item		Standard
1	Material	FCCL（adhesive）	Shengyi SF302:PI=0.5mil,1mil and 2mil; Cu=0.33oz,0.5oz and 1oz
2		FCCL（adhesiveless）	Panasonic R‐F775:PI=1mil and 2mil; Cu=0.33oz, 0.5oz and 1oz
2		FCCL（adhesiveless）	DuPont Pyralux AP:PI=1mil, 2mil and 3mil; Cu=0.33oz, 0.5oz and 1oz
3		Coverlay	Shengyi SF302C: 0515, 1025 and 2030
3		Coverlay	Taiflex FHK: 0515,1025 and 2035
4		Adhesive	Taiflex BT: AD=10um, 25um and 40um
5		PI stiffener	Taiflex MHK: PI=3mil, 5mil, 7mil and 9mil
6		3M	9460, 6677, 9458, 468
7		NO FLOW PP	Ventec:VT‐47N
8		CCL	ITEQ: IT‐180A; Shengyi: S1000‐2
9		Other CCL	Arlon: 85N; Rogers: RO4000 series; Nelco:N4000‐13 series
10	Others	Design software	CAM350、PROTEL、PADS、POWERPCB、AUTOCAD、 GENESIS、ORCAD
11		Gerber format	RS‐274‐D、RS‐274‐X
12		Drill format	EXCELLON format
13		Layer	2‐10
14		Board thickness	0.2mm‐3.0mm
15		Tolerance of boad thickness (thickness＞1.0mm)	±10%
16		Tolerance of boad thickness (thickness≤1.0mm)	±0.1mm
17		Min. board size	*10mm15mm**
18		Max. board size	*400mm550mm**
19		Impedance control tolerance	Single‐ended: ±5Ω(≤50Ω),±10%(>50Ω)
19		Impedance control tolerance	Differential: ±5Ω(≤50Ω),±10%(>50Ω)
20		HDI	/
21		Min. bow&twist	0.75%(symmetrical),2%(unsymmetrical)
22	Inner layer	Min. line width/spacing (12,18um copper)	3.5/3.5mil (3.2/3.2mil)
23		Min. line width/spacing (35um copper)	4/4mil ( 3.5/3.5mil)
24		Min. line width/spacing (70um copper)	6/7mil (5.5/6.5mil)
25		Annular ring(blind via)	4mil
26		Max. copper thickness	2oz
27	Outer layer	Min. line width/spacing (18um copper)	4/4mil (3.5/3.5mil)
28		Min. line width/spacing (35um copper)	4.5/4.5mil (4/4mil)
29		Min. line width/spacing (70um copper)	6/9mil (5.5/8.5mil)
30		Min. line width/spacing (105um copper)	10/13mil (9.5/12.5mil)
31		Min. line width/spacing (18um copper,flex on the surface of board)	5/5mil (4.5/4.5mil)
32		Min. line width/spacing (35um copper,flex on the surface of board)	5.5/6mil (5/5.5mil)
33		Min. line width/spacing (70um copper,flex on the surface of board)	7.0/10mil (6.5/9.5mil)
34		Min. BGA pad size	12mil(8mil for electrical soft gold board)
35		Max. finished copper thickness	3oz
36	Drilling	Blind via	/
37		Max. buried via	0.4mm
38		Aspect ratio (mechanical drill)	10:1
39		Aspect ratio (laser drill)	/
40		Min. distance between via and conductors	6mil (≤6layer)
			8mil(7~11layer)
			12mil(≥12layer)
42		Tolerance of non‐plated holes	±2mil(limited is +0/‐2mil or +2mil/‐0)
43	Solder mask and silk screen	Solder mask color	green,black,blue,red, matte green,white
44		Min. solder dam (copper≤1oz)	4mil(green, red and blue), 5mil(black and white)
45		Min. solder dam (copper2‐4oz)	8mil
46		Min. clearance	2.5mil (2.0mil)
47		Diameter of plugged hole	/
48		Aspect ratio(hole plugged with non‐conductive resin)	/
49		silk color	white,yellow,black
50	Surface treatment	Surface treatment	HASL/LF HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Immersion silver, Immersion tin and OSP
51		Mixed surface treatment	ENIG+OSP,ENIG+Gold finger,Electrical gold+ Gold fingers
52		Gold thickness (ENIG)	0.05‐0.10um
53		Nickel thickness (ENIG)	3‐8um
57		Hard gold thickness(leadless)	0.1‐1.5um
58		Hard gold thickness(including lead)	0.1‐4.0um
59		Electrolytic Nickel thickness	≥3um
60		Electrolytic Gold thickness	0.05‐0.10um
61		Immersion silver thickness	0.2‐0.4um
62		OSP thickness	0.1‐0.3um
63	Routing	Tolerance of board outline	±4mil(exclude complicated board outline and cutout)